Over 1.5 times better strength 2.5 times better elongation than Sn-Pb.
Better wetting than sac 305. (Flow-up in holding bath possible)
Copper corrosion decreases greatly. (1/4 or less that of Sn-Pb)
Conventional solder machine is applied. (Flow-up at solder temperature of 210° ⇒ lower use of energy ⇒ reduction in CO2 gas emissions)
Appearance of the test specimen at 25° and 80°
Statics type 210° 5sec dipping
Suitable for paper phenol pcb.
Suitable for connector soldering after reflow.
No Fillet-Lifting. (No land lifting or liftoff)
Suitable for Reball, Rework and Repair.